Reduced size imaging device

ABSTRACT

A reduced diameter in vivo imaging device, such as a swallowable imaging capsule. The imaging device includes a first circuit board configured for accommodating at least an image sensor, and a second circuit board, which is in electrical communication with the first circuit board and which extends substantially perpendicularly from the bottom surface of the first circuit board.

FIELD OF THE INVENTION

The present invention relates to imaging devices, and particularly toimaging devices including configurations allowing for reduced area,size, length or reduced diameter or cross-sectional area

BACKGROUND OF THE INVENTION

Remote imaging and other sensing devices are used in numerous industrialand medical applications. Many of these applications call for theimaging of areas that can be reached only by way of narrow points ofaccess. An example of such an application is in vivo imaging wherein animaging device is inserted into a body lumen to image areas within thebody.

Several factors have so far limited the extent to which the diameter orother dimensions of an imaging device can be reduced. A first factor isthe diameter of the circuitry connected to the imaging sensor portion ofthe imaging device. This circuitry, generally in the form of anintegrated circuit on a chip such as a silicon chip, may processes imagesignals generated by an imaging sensor. The circuit that processes thesignals generated by the imaging sensor is generally referred to as theprocessing chip although such circuitry and such “processing chip” neednot be on or associated with a traditional “chip”. The diameter of theprocessing chip may be a limitation to possible reductions in thediameter, length or size in general of the imaging device.

A second factor that has limited the reduction in the size of imagingdevices is the cumulative widths of the several components of theimaging device that in some configurations are situated on the plane ofthe imaging device which faces the surface to be imaged. These itemshave generally included, for example, at least the imaging sensor, whichtypically sits behind an optical lens, and at least one illuminationsource for illuminating the surface to be imaged. The placement of bothof these components on the same plane has limited the possibility ofreducing the diameter of such plane and hence the diameter of theimaging device.

The size of available imaging devices relative to the small openings ofmany body lumens or relative to body lumens of small diameter, such asin children, may be limiting. A reduced size imaging device may providegreater access to body lumens with narrow or restricted points ofaccess. Furthermore, there may be a need to use space within imagingdevices in a more efficient manner. There is a need for an imagingdevice with a reduced size such that the imaging device can be, forexample, inserted or pass through very narrow points of access.

SUMMARY OF THE INVENTION

Some embodiments of the present invention may, for example, enable areduced diameter, reduced length, or reduced size imaging or othersensing device. According to one embodiment, a processing chip or aboard, circuit board, or holder holding such a chip, is alignedsubstantially perpendicular to the plane of an imaging sensor. Thethickness of the processing chip can be small, such that as so aligned,the profile area of the processing chip does not constrain reductions inthe diameter of the imaging device. The physical and electricalconnection between the imaging sensor and the processing chip may bemade by way of, for example, a printed circuit board (PCB), to whichboth the imaging sensor and the processing chip are connected. In anembodiment of the present invention, the imaging sensor is connected tothe side edge of the PCB such that the PCB may also be situatedsubstantially perpendicular to and behind the imaging sensor. Theelectrical connections that carry power from the PCB to the imagingsensor and that carry image signals from the imaging sensor to the PCBmay be made for example by way of leads ending at the side edge of thePCB to which the imaging sensor is attached. The processing chip maythen be attached to the PCB in parallel to the plane of the PCB, suchplane typically being substantially perpendicular to the imaging sensor.The arrangement of the PCB and the processing chip substantiallyperpendicular to the imaging sensor allows a reduction in the diameterof the imaging device where reductions in such diameter may theretoforehave been limited by the width of the PCB and the processing chip.

According to another embodiment, at least one light source, typically inthe form of one or more light emitting diodes (LEDs), although othersuitable light sources may be used, may be situated behind andsubstantially perpendicular to the plane of an imaging sensor. The lightproduced by the light source may be emitted for example parallel to theplane of the imaging sensor and can then be refracted or reflected by alight deflecting element, such as a prism or mirror, which is attachedor otherwise held in place in the path of the light emitted by the lightsource. The refraction or path-alteration of the light deflectingelement directs the light emitted by the light source towards the planeof the imaging sensor so that the light exits the imaging devicesubstantially perpendicular to such plane. By situating the at least onelight source behind and substantially perpendicular to the imagingsensor, it may be possible to reduce the diameter of the imaging device.

The device and system according to some embodiments of the presentinvention also may permit a reduction in the number of separateelectrical connections that need be made between the various componentsof an imaging device and between the circuits to which such componentsare attached. In an embodiment of the present invention, any of thelight sources and the processing chip may be attached directly to thePCB that may be situated substantially perpendicular to the imagingsensor. This PCB may be the same PCB to which the imaging sensor isattached. The connection of the light sources or the processing chip tothe PCB may be by way of for example pins or other suitable connectionsthat may provide either or both of a physical and electrical connectionto the circuit. Similarly, such PCB may include a niche into which maybe inserted and held one or more batteries or other power supplysources, such as rechargeable devices, which may be held in directcontact with the PCB. Such power sources may be held in parallel orperpendicular to the plain of the PCB. Such direct contact may provideeither or both of a physical and electrical connection between suchpower supply and the PCB.

There is thus provided, according to an embodiment of the invention anin vivo imaging device, such as a swallowable imaging capsule. Accordingto one embodiment the imaging device includes a first circuit boardincludes, or is configured for accommodating or having disposed thereon,at least an image sensor, and a second circuit board, which is inelectrical communication with the first circuit board and which extendsat an angle of between about 0° to about 180° from the bottom surface ofthe first circuit board. The first circuit board may be perpendicular toor substantially perpendicular to the first circuit board. The secondcircuit board may, for example, have disposed thereon a processing chip.

According to another embodiment of the invention there is provided acircuit board configured for being in electrical communication withanother circuit board and extending substantially perpendicularly to theother circuit board.

Also provided, according to other embodiments of the invention is animage sensor which is configured for being in electrical communicationwith a circuit board, the circuit board extending substantiallyperpendicularly to the image sensor.

According to another embodiment there is provided, in an in vivo imagingdevice, a single circuit board that is configured for accommodating animage sensor and at least one illumination source.

According to yet another embodiment there is provided a circuit boardwhich has a transmitter and a transmitter antenna, where the antenna isembedded into the circuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be understood and appreciated more fully fromthe following detailed description taken in conjunction with thedrawings in which:

FIG. 1A is a simplified illustration of a reduced diameter imagingdevice wherein the processing chip, the circuit board and the lightsource are situated behind and substantially perpendicular to the planeof the imaging sensor, in accordance with an embodiment of the presentinvention;

FIG. 1B is an illustration of an imaging device in accordance withanother embodiment of the present invention;

FIG. 1C is an illustration of an imaging device in accordance with yetanother embodiment of the present invention;

FIGS. 2A-2C are simplified illustrations of a connection of an imagingsensor onto a circuit board, in accordance with embodiments of thepresent invention;

FIG. 3 is a simplified illustration of a light source situated behindand substantially perpendicular to the imaging sensor, and to which isattached a prism that alters the path of the light emitted by the lightsource, in accordance with an embodiment of the present invention;

FIG. 4 is a simplified illustration of a circuit board, which includes aniche or other area into which may be inserted and held one or morebatteries or other power source in accordance with an embodiment of thepresent invention; and

FIGS. 5A-5C are schematic illustrations of different possiblearrangements of an antenna within an imaging device according toembodiments of the invention.

DETAILED DESCRIPTION OF THE INVENTION

In the following description, various aspects of the present inventionwill be described. For purposes of explanation, specific configurationsand details are set forth in order to provide a thorough understandingof the present invention. However, it will also be appreciated by oneskilled in the art that the present invention may be practiced withoutthe specific details presented herein. Furthermore, well known featuresmay be omitted or simplified in order not to obscure the presentinvention.

Reference is made to FIG. 1A which shows a simplified illustration of areduced size, length or size imaging device wherein a processing chip, acircuit board, such as a PCB, and the light source are situated behindand substantially perpendicular to the plane of the imaging sensor, inaccordance with an embodiment of the present invention. The imagingdevice 100A may include an optical head 101, an imaging sensor 107,which is typically physically, electrically and/or electronicallyconnected to an imaging sensor circuit board 109, a processing chip 114that may, for example, processes the signals generated by imaging sensor107, a circuit board 112 that connects imaging sensor circuit board 109to processing chip 114 and possibly to certain other components of theimaging device 100A, one or more light sources 110 (e.g., light emittingdiodes (LEDs) or other suitable sources) to illuminate the area to beimaged 120, one or more prisms 108 or other refracting or reflectingelements to, for example, refract or alter the path of the lightproduced by one or more light sources 110 and a power source which mayfor example include one or more batteries 118. Batteries 118 may beconnected by wires (not shown) or other connections to the circuit board112. The imaging device may also include, for example, a transmitter 122to transmit the signals processed by processing chip 114 and an antenna116 to be used in such transmission. Typically, transmitter 122 sendssignals to an external receiver (not shown), which may receive andprocess such signals. In alternate embodiments, other components andarrangement of components may be used. For example, transmitter 122 neednot be used. According to some embodiments processing chip 114 andtransmitter 122 may be integrated on the same chip.

The imaging device 100A is typically autonomous, including a powersource or power source receiving device and a transmitter for wirelesslytransmitting data, but need not be. For example, a wired device,exchanging data and/or power with an external system via wires, may beused.

While various benefits such as size, length or size are discussed asresulting from the various embodiments discussed herein, other benefitsmay be realized. For example, more components may be included in adevice where space is saved.

In one embodiment, circuit board 112 may include, or may be configured,for example, for holding or accommodating, components such as aprocessing chip 114, light source(s) 110, transmitter 122, or othersuitable components. Circuit board 109 may include or may be configured,for example, for holding or accommodating an imaging sensor 107 or othercomponents. In alternate embodiments, the various arrangements ofcomponents may be altered. For example, light sources may be included onthe same board or holder as an imager.

In certain embodiments, a circuit board may include a switch. Accordingto one embodiment the switch is a magnetic switch, such as amicro-electro-mechanical system (MEMS) switch. The switch may beconfigured to control at least one electrical component of, for example,an imaging device. The switch may be disposed between portions of theelectrical circuitry of the device 100A, such that when the switch isopen, some or all components of device 100A are powered off or on, orare operative or inoperative. A magnetic switch may be, for example,constructed of a suitable magnet or materials responsive to magneticforces such that it may be moved and operated upon exposure of thedevice 100A to a magnetic field. Alternately, other suitable controlcircuits may be used.

Embodiments of the imaging device may include components and operatesimilarly to embodiments described in U.S. Pat. No. 5,604,531 to Iddan,et al. and/or WO 01/65995, both assigned to the common assignee of thepresent application and hereby incorporated by reference; however,embodiments of the present invention may be used with other imagingsystems or other arrangements of components. Further, a receiving anddisplay system as disclosed in embodiments described in U.S. Pat. No.5,604,531 to Iddan, et al. and/or WO 01/65995 may be used with orincluded in embodiments of the present invention, although othersuitable receiving and display systems may be used. Typically, theimaging device 100A is a capsule or capsule shaped device inserted intoa body lumen such as, for example, the gastrointestinal tract, whichtransmits or otherwise sends images to an external receiver or recorder.For example, the device may be ingested. In alternate embodiments, theimaging device need not be a capsule. For example, the imaging devicemay be the tip of a medical device, such as, an endoscope, needle,catheter, stent etc.

The optical head 101 may include one or more optical elements, such asone or more lenses 104 and a lens holder 106. One or more suitableoptical elements may be used for focusing images onto imaging sensor107. The optical head 101 may be part of, attached to, mounted on orotherwise disposed adjacent to the imaging sensor 107. The optical head101 may be placed behind an optical window or dome 102 to, for example,isolate its electric components from liquids found in a body, which mayinterfere with the operation of such components. The optical head 101may be manufactured as a single assembly or may include separateassemblies that are connected in the imaging device. In alternateembodiments, the optical head need not be used, and other arrangementsfor focusing the image may be used.

The imaging sensor 107 may be, for example, a solid state imagingsensor, such as charged coupled devices (CCDs) and complementary metaloxide semiconductors (CMOS). The imaging sensor 107 can be, for example,3 mm sq with an active area of about 1.8 square mm, with dimensions ofabout 0.8 mm in width. Other suitable dimensions may be used.

In a typical embodiment of the present invention, circuit board 112 liesat an angle from 0° to 180° to the plane of the imaging sensor, or fromthe plane of a circuit board or other holder holding or including theimaging sensor (e.g., circuit board 109). According to one embodimentthe circuit board 112 is substantially perpendicular to the plane ofimaging sensor 107 and imaging sensor circuit board 109. Circuit board112 may include, for example, a PCB or other device for electricaland/or physical connection by which imaging sensor 107 and imagingsensor circuit board 109 can be held in place, by which power can besupplied to the image sensor 107 and by which signals can be conductedfrom the imaging sensor 107 to the processing chip 114 or othercomponents. Alternatively, circuit board 112 can be used to transmitsignals to the processing chip 114, while another mechanism is used tohold the imaging sensor 107 in place. Processing chip 114 may beattached to circuit board 112 such that it lies in parallel to circuitboard 112 and perpendicular to the plane of imaging sensor 107 andimaging sensor circuit board 109. If circuit board 112 is a PCB, thenprocessing chip 114 may, for example, be attached to such PCB by way ofpins as are know in the art. Typically, processing chip 114 containscircuitry for processing image signals. According to some embodimentsthe device 100A may contain other in vivo sensors (such as, for example,pH sensors, temperature sensors, pressure sensors etc.) and theprocessing chip may contain circuitry for processing signals other thanimage signals.

Imaging sensor 107 may generate electronic signals such as imagesignals. Image signals may be transmitted by way of imaging sensorcircuit board 109 through circuit board 112 to processor chip 114.Processor chip 114 may carry out processing or conditioning of the imagesignal, for example so that it may be viewed on a display system such ason a monitor, or for other reasons. An example of a processor chip thatmay be used in embodiments of the present invention is an ASIC(application specific integrated circuit). According to one embodimentthe ASIC may have transmitting capabilities, for example, operating on aminimum shift keying (MSK) modulation system to effect transmitting ofdigital signals through an antenna on radio frequencies to a receivingsystem. The ASIC may also control the illumination and imaging sensor107, for example as described in embodiments of the above mentioned WO01/65995. In alternate embodiments, other signals and other electronicand processing components may be used. For example, a processor chipneed not be included, or need not be mounted on the circuit board 112.Similarly, an imaging sensor circuit board 109 need not be used.

According to one embodiment device 100A is capsule shaped. In otherembodiments of the present invention, the device may be constructed inother shapes such, for example, as a sphere, circular cylinder, anelliptical cylinder, a rectangle, a trapezoid or other suitable shapes.

FIG. 1B is an illustration of an alternative placement of certaincomponents of imaging device 100B in accordance with an embodiment ofthe present invention. As is depicted in such illustration, processingchip 114 and transmitter 122 may be placed proximate to the location ofimaging sensor 107, whereas light source 110 may be located moreremotely from the imaging sensor 107. FIG. 1B likewise depicts analternative embodiment of the present invention wherein one or more ofprisms 108 are located outside of the coverage of optical window or dome102. Such location of prisms 108 outside of the coverage of opticalwindow or dome 102 may, for example, reduce the amount of back scatterlight from the optical window or dome 102, although such a result is notrequired. Other configurations of one or more of prisms 108 or otherlight guides or light bending devices placed either inside or outside ofthe coverage of optical window or dome 102 are possible.

FIG. 1C is an illustration of an alternative placement of certaincomponents of imaging device 100C in accordance with another embodimentof the present invention. According to this embodiment illuminationsources, such as Light sources 110 may be situated on the same circuitboard 112 as the imaging sensor 107. Such placement may, for example,eliminate the need for imaging sensor circuit board 109, although suchresults are not required. Lens holder 106 may include, for example,opaque material or otherwise be constructed to ensure that lightdirectly emitted from Light sources 110 is not incident on imagingsensor 107. A processing chip (not shown) may also be integrated oncircuit board 112. Similar numerals to those in the figures describedabove have been assigned to like elements.

Reference is made to FIGS. 2A-2C which schematically illustrate asubstantially connection of an imaging sensor and a circuit board withanother circuit board in accordance with an embodiment of the presentinvention. The connection is typically perpendicular but other suitableangles may be used. In a typical embodiment, imaging sensor 107 rests onand is electrically connected to imaging senor circuit board 109 by wayof, for example, pins or other methods known in the art The back surface200 of imaging sensor circuit board 109, being the surface away fromimaging sensor 107, may be fitted, for example, with at least onerecess, such as socket or slot(s) 202 into which the side edge 206 ofcircuit board 112, or leads, connectors or tabs extending from circuitboard 112, may be inserted and held. Slot(s) 202 may, for example,provide a secure physical connection between the back surface 200 ofimaging sensor circuit board 109 and the side edge 206 of circuit board112. Circuit board 112, as shown in FIG. 2B, may include leads 204 whichare typically embedded in circuit board 112 providing an electricalconnection between circuit board 112 and imaging sensor circuit board109. Circuit board 112, shown in FIG. 2C may include leads 204 or otherconnectors ending at the side edge 206 of circuit board 112, typicallyin the outermost layer of the circuit board, providing an electricalconnection between circuit board 112 and imaging sensor circuit board109. Other arrangements of connecting circuit board 112 and image sensorcircuit board 109, or providing electrical connections therebetween, orof holding image sensor 107 in place may also be used. For example, theback surface 200 may include clasps that may clasp onto the side edge206 of circuit board 112. According to one embodiment circuit board 112includes a recess or niche 400 which may be used to accommodate elementsof the device, such as one or more batteries or other power sources, abattery pack or a suitable rechargeable power supply.

Reference is made to FIG. 3 which is a simplified illustration of alight source assembly, typically situated behind and substantiallyperpendicular to an imaging sensor, and to which is attached a lightguide or prism that may alter the path of the light emitted by the lightsource(s), in accordance with an embodiment of the present invention.The light source assembly may, for example, be used in embodiments ofthe device described herein, such as device 100A or other devicesdescribed herein. Light source 110 can be, for example, one or morelight emitting diodes (LEDs) or other suitable sources of light. All orpart of the light 300 produced by light source 110 may, for example, beemitted substantially perpendicular to the plane of circuit board 112and substantially parallel to the plane of imaging sensor 107. Prism 108may be affixed in the path of light 300. The angled edge 306 of prism108 can be, for example, coated with silver or a similar reflectivecoating 310 to reflect light 300. Angled edge 306 of prism 108 istypically set at an angle of approximately 45 degrees relative to thesurface of light source 10 and the point 304 thereon from which light300 is emitted, although other suitable angles may be used. As light 300is emitted from light source 110, it may be, for example, refracted bythe prism 108 and/or reflected by the reflective coating 310 on anglededge 306 such that light 300 passes towards and through the optical dome102 to illuminate the surface to be imaged 120. A light shield in theform of, for example, a reflective coating may also be added to otherexternal surfaces of prism 108 to further direct light 300 towards thesurface to be imaged 120. Light shield 302 may also, for example,prevent light 300 from reaching the imaging sensor 107 directly fromprism 108. Prism 108 may be glued or otherwise attached to light source110 or may be held in place by optical window or dome 102 or by othermethods, for example mechanical methods. Other light redirecting devicesmay be used instead of a prism, such as a mirror or a fiber optic lightguide.

Reference is made to FIG. 4, which is a simplified illustration of acircuit board in the form of a PCB. The circuit board 112 may, forexample, be used in embodiments of the device described herein, such asdevice 100A or other devices described herein. The circuit board 112,according to an embodiment of the invention, is configured forcontaining or holding a power source, such as one or more batteries or abattery pack. For example, circuit board 112 includes an inset, cutoutor niche 400 into which may be inserted and held one or more batteries118 or other power source(s), which may be held in physical andelectrical contact with the circuit board 112. Circuit board 112 may be,for example, a PCB, but other suitable structures may be used. Niche 400may be constructed with, for example, one or more protrusions 402 tohold the one or more batteries 118 in place and to maintain electricalcontact between circuit board 112 and the one or more batteries 118.Other methods of maintaining physical and electrical contact may also beused. Leads 404, which may for example be placed on circuit board 112,may conduct power from the one or more batteries 118 to the othercomponents of the device. Batteries 118 may rest in parallel to orperpendicular with the plain of circuit board 112, or at anothersuitable angle therewith. Placement of one or more batteries 118 indirect electrical contact with circuit board 112 may reduce the numberof electrical connections that are made between circuit board 112 andother components that are included in a device.

In various embodiments of the present invention, the circuit arrangementaccording to various embodiments described herein may be used withoutthe illumination arrangement according to various embodiments describedherein, and vice versa. Similarly, each of such arrangements may be usedin conjunction with or without the arrangement described above forholding one or more power source within the niche 400. Likewise, theposition of various components of the imaging device 100 such as theprocessing chip 114, transmitter 122, antenna 116, and power source,such as, for example, batteries 118 can be varied relative to each otherand their location on circuit board 112.

Reference is now made to FIGS. 5A-5C, which are schematic illustrationsof different possible arrangements of components in an in vivo imagingdevice, according to embodiments of the invention. Similar numerals tothose in the figures described above have been assigned to likeelements. In FIG. 5A components in an imaging device 500A, such as thetransmitter 122, processing device or chip 114 and additional components1120 such as resistors, capacitors, switches etc., are arranged oncircuit board 112. Circuit board 112, which may extend from the imagingsensor circuit board 109 substantially perpendicularly, may be situatedoff center relative to imaging sensor circuit board 109, for example,making room for antenna 116 to compactly fit into the imaging device500A. The antenna 116 may, for example, be disposed substantiallybetween a power source (such as, for example, one or more batteries 118,a device receiving power from an external source, etc.) and the imagingsensor circuit board 109 and/or imager 107. In some imaging or sensingcapsules an antenna is positioned along the width of the capsule at oneend of the capsule. An arrangement in which the antenna 116 ispositioned in between the imaging sensor circuit board 109 and thebatteries 118 along the length of the capsule, for example asillustrated in FIG. 5A, may, for example allow the reduction in thelength of the device, such as a capsule shaped imaging device. Other ordifferent benefits are possible. Other arrangements of components may beused. Other types and numbers of antennas, with other shapes, may beused.

Another possible arrangement according to an embodiment of the inventionis schematically illustrated in FIG. 5B. Device 500B, which may be, forexample, oblong or capsule shaped, includes a transmitter 122 and aprocessing chip 114 arranged on circuit board 112. For clarity, only oneend of the device is shown in FIG. 5B. One or more batteries 118 (orother suitable power sources), which are electrically connected tocircuit board 112, provide power to the device elements. Antenna 116 maybe arranged around the inner diameter of the device 500B substantiallysurrounding the circuit board 112 and/or the transmitter 122. In such acase, the length of the device 500B may be reduced; other or alternatebenefits are possible. Device 500B may be an image sensing device oranother sensing device. Sensors, such as a pH sensor, a pressure sensor,an electrical field sensor, an ultrasonic sensor, a temperature sensoror any other known in vivo sensor, may be included in the device,according to embodiments of the invention. Other types and numbers ofantennas, with other shapes, may be used.

In FIG. 5C a device 500C is illustrated in which an antenna 116′ issubstantially embedded into a circuit board 112. Circuit board 112 maybe arranged in parallel or in other relations to the image sensorcircuit board 109. The embedding of the antenna 116′ in the circuitboard 112 according to embodiments of the invention may enables usingthe space previously occupied by the antenna, for example for addingadditional components to the device. Alternatively the unused space maybe eliminated from the device 500C thereby reducing the device overalldimensions. Other types and numbers of antennas, with other shapes, maybe used. Other components as described herein, such as lenses 104,imaging sensor 107, etc., may be included.

While the present invention has been described with reference to a fewspecific embodiments, the description in intended to be illustrative ofthe invention as a whole and is not to be construed as limiting theinvention to the embodiments shown. It is appreciated that variousmodifications may occur to those skilled in the art that, while notspecifically shown herein, are nevertheless within the true spirit andscope of the invention.

It will be appreciated by persons skilled in the art that the presentinvention is not limited by what has been particularly shown anddescribed herein above. Rather the scope of the invention is defined bythe claims, which follow.

1. An in vivo imaging device comprising: a first circuit board havingdisposed thereon an image sensor, said first circuit board having a topsurface and a bottom surface; and a second circuit board, said secondcircuit board being in electrical communication with the first circuitboard and extending at an angle of between about 0° to about 180° fromthe bottom surface of the first circuit board.
 2. The device accordingto claim 1 wherein the second circuit board is substantiallyperpendicular to the first circuit board.
 3. The device according toclaim 1 wherein the first circuit board has disposed thereon least oneillumination source.
 4. The device according to claim 3 wherein theillumination source includes an LED.
 5. The device according to claim 1wherein the second circuit board comprises circuitry for processingimage signals.
 6. The device according to claim 1 wherein the secondcircuit board is configured for accommodating an ASIC.
 7. The deviceaccording to claim 1 wherein the second circuit board is configured foraccommodating a transmitter.
 8. The device according to claim 1 whereinthe second circuit board includes an illumination source.
 9. The deviceaccording to claim 8 wherein the illumination source includes an LED.10. The device according to claim 8 comprising a light redirectingdevice.
 11. The device according to claim 10 wherein the lightredirecting device is selected from the group consisting of: a prism, amirror and a fiber optic light guide.
 12. The device according to claim1 wherein the second circuit board is configured for containing a powersource.
 13. In an in vivo imaging device, a circuit board configured forbeing in electrical communication with another circuit board andextending substantially perpendicularly to the other circuit board. 14.The circuit board according to claim 13, comprising attaching means forattaching the circuit board substantially perpendicularly to the othercircuit board.
 15. The imaging device according to claim 14 wherein theattaching means includes electrically communicating means.
 16. Theimaging device according to claim 13 comprising circuitry for processingimage signals.
 17. The imaging device according to claim 13 wherein thecircuit device is configured for accommodating at least a transmitter.18. The circuit device according to claim 13 wherein the circuit deviceis configured for accommodating at least an illumination source.
 19. Thecircuit device according to claim 18 wherein the illumination sourceincludes an LED.
 20. In an in vivo imaging device, an image sensor, saidsensor configured for being in electrical communication with a circuitboard, said circuit board extending substantially perpendicularly to theimage sensor.
 21. The image sensor according to claim 20 comprising aniche configured for accommodating a side edge of a second circuitboard.
 22. The image sensor according to claim 21 wherein the nichecomprises communication means for electrically communicating with theother circuit board.
 23. In an in vivo imaging device, a circuit boardconfigured for accommodating an image sensor and at least oneillumination source.
 24. The circuit board according to claim 23 whereinthe illumination source includes an LED.
 25. In an in vivo imagingdevice, a circuit board comprising a transmitter and a transmitterantenna, said antenna being embedded into the circuit board.
 26. An invivo imaging device comprising: a circuit board; a transmitter; and anantenna, said antenna substantially surrounding the circuit board. 27.The device of claim 26, comprising an imager.
 28. The device of claim26, wherein the antenna substantially surrounds the transmitter.
 29. Anin vivo imaging device comprising: an imager; a power source; and anantenna, said antenna disposed substantially between the power sourceand the imager.
 30. The device of claim 29, wherein the power sourceincludes a battery.
 31. A capsule comprising: an optical window behindwhich are disposed: an illumination source; a first circuit boardconfigured for accommodating at least an image sensor, said firstcircuit board having a bottom surface; and a second circuit board, saidsecond circuit board being in electrical communication with the firstcircuit board and extending substantially perpendicularly from thebottom surface of the first circuit board.
 32. The capsule according toclaim 25 comprising a transmitter.
 33. The device according to claim 8wherein the illumination source includes an LED.